タケダ　ショウ   Syo Takeda   武田　翔    所属   石巻専修大学  理工学部    職種   准教授
言語種別	日本語
発行・発表の年月	2017
形態種別	論文
標題	繰り返し一方向摺動プロセスによる金属粉末の接合メカニズムの検討
執筆形態	未選択
掲載誌名	M&M材料力学カンファレンス
出版社・発行元	一般社団法人 日本機械学会
巻・号・頁	2017(0),OS1623頁
著者・共著者	武田 翔,三木 寛之,FONTAINE Julien,GUIBERT Matthieu,宮崎 孝道,高木 敏行
概要	<p>To investigate the interparticle bonding process of the powder particles during the compression shearing method at room temperature, unidirectional friction tests with different normal loads and number of sliding passes were carried out to uniaxial-compressed samples. Pure Cu is chosen as a material in this study and Pure Cu powder was compressed under the uniaxial normal stress of 1000 MPa in order to get compressed samples with the target size of 20 × 20 × 0.25 cm3. The relationship between the normal loads applied, the number of the sliding passes, and the bonding condition of the powder particles was investigated by observing the surface structure and the fracture surface of the samples after the friction test. The surface of the powder particles were deformed and bonded each other by applying a repetitive unidirectional sliding process. The thickness of the bonded each other region from the surface increased 1.0 to 4.0 μm by increasing normal load applied 4.0 to 27 N. The thickness of the bonding region did not change by increasing of the number of the sliding passes from 100 to 200. From these results, it was clarified that the normal load more effective for deformation and the bonding of the powder particles than the number of passes.</p>
DOI	10.1299/jsmemm.2017.OS1623
NAID	130006726955