タケダ　ショウ   Syo Takeda   武田　翔    所属   石巻専修大学  理工学部    職種   准教授
言語種別	日本語
発行・発表の年月	2018
形態種別	論文
標題	繰り返し一方向摺動による金属粉末接合プロセスの解明
執筆形態	未選択
掲載誌名	年次大会
出版社・発行元	一般社団法人 日本機械学会
巻・号・頁	2018(0),J0460103頁
著者・共著者	武田 翔,三木 寛之,FONTAINE Julien,GUIBERT Matthieu,小助川 博之,中山 昇,武石 洋征,高木 敏行
概要	<p>In this study, a repetitive unidirectional friction experiment was conducted on uniaxially compressed sample of metal powder in order to clarify the behavior of solid-state bonding on metal powder particles by simultaneous application of compressive and shearing force. Pure Cu powder was compressed under the normal stress of 1000 MPa to get uniaxially compressed sample with the target size of 20×20×0.25 mm3. The relationship between a normal load, a number of sliding cycles, and microstructural changes of samples after the unidirectional friction experiment was investigated by observing sample structures of fracture surfaces and cross-sections. As the results, it was found that the applied stress is more dominant in the particle bonding than the strain. In addition, it was suggested that the bonding of powder particles is proceeded as this order: (1) plastic deformation of particles; (2) grain refinement to a size of several micro-meter; (3) bonding of particles; (4) additional grain refinement to submicron size.</p>
DOI	10.1299/jsmemecj.2018.J0460103
NAID	130007619493